Detection speed reaches 3000mm²/s.
Standardized LED automatic optical inspection equipment.
It can perform appearance defect imaging on the front and back of the LED.
Dual track fast acquisition
The equipment adopts full-automatic loading and unloading and double-track quick image acquisition. It is inspected by machine vision and automatically rejects defective LED chips according to the inspection results.
Can perform appearance defect imaging on the front and back of the LED
Ion static elimination technology ensures the protection of materials during transmission, imaging, and poor processing
Use imported inkjet equipment to mark the detected appearance defect products with bad ink
Connecting module with process equipment after LED packaging process
Equipment name: Online automatic Chip LED packaging appearance inspection machine
Bracket size: 510mm X 460mm (without inkjet device)
460mm X 350mm (including inkjet device)
Resolution: 6um ~ 10um (adjustable)
Dimensions: W1000mm X D1170mm X H1800mm
Dimensions: W2200 x D1520 x H1750 mm